Which 3D printing technology is best for copper parts in electronics applications?

Which 3D Printing Technology Is Best for Copper Parts in Electronics Applications?

Optimal Technology: Selective Laser Melting (SLM) with High-Power Lasers

For functional copper parts in electronics applications, Selective Laser Melting (SLM) is the most effective 3D printing technology. SLM systems equipped with high-power green or infrared lasers can successfully process pure copper and high-conductivity copper alloys, such as Copper C101 and Copper C110, which are widely used in electrical and thermal systems.

SLM is preferred because it enables high-density, fully fused copper parts with excellent electrical conductivity (>90% IACS) and thermal conductivity (>380 W/m·K), meeting the performance needs of advanced electronics.

Why SLM Is Preferred for Copper in Electronics

• High laser absorptivity at shorter wavelengths (green laser) improves fusion quality for copper’s reflective surface.

• Achieves over 98% relative density with low internal porosity.

• Supports complex geometries such as conformal cooling channels and embedded conductor paths.

• Maintains critical tolerances for thin walls and compact electronic enclosures.

Applications in Electronics

SLM-printed copper is used in:

• RF and microwave waveguides

• Inductors, antennas, and EMI shielding

• Heat exchangers and cold plates

• Electrical bus bars and connector housings

• Conformal coils and winding assemblies for sensors and actuators

Customer-Oriented Solutions and Services

To support copper part production for electronics, we offer:

1. 3D Printing Technologies:

   • Utilize Copper Alloy 3D Printing based on SLM for precision electrical and thermal performance.

2. Copper Material Selection:

   • Choose from Copper C101, Copper C110, and CuCr1Zr based on conductivity, strength, and form factor requirements.

3. Electronics Industry Solutions:

   • Explore our consumer electronics and energy and power applications, supported by CNC machining and surface treatment for post-processing and performance tuning.