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Copper C101

Copper C101 is the premier choice for applications requiring high thermal and electrical conductivity with excellent machinability and purity.

Introduction to Copper C101 for 3D Printing

Copper C101, also known as oxygen-free high-conductivity (OFHC) copper, contains a minimum of 99.99% pure copper. It offers outstanding electrical conductivity (>100% IACS), high thermal conductivity (391 W/m·K), and excellent ductility, making it ideal for RF components, busbars, thermal sinks, and advanced electronics.

Using precision methods like Direct Metal Laser Sintering (DMLS) and Electron Beam Melting (EBM), Copper C101 achieves dimensional tolerances of ±0.1 mm while retaining superior thermal and electrical properties.

International Equivalent Grades of Copper C101

Country	Grade Number	Other Names/Titles
USA	C10100	OFHC Copper
Europe	CW008A	EN 13601
UK	C101	BS EN 12163
Japan	C1011	JIS H3100
China	TU0	GB/T 5231

Comprehensive Properties of Copper C101

Property Category	Property	Value
Physical	Density	8.94 g/cm³
	Melting Point	1,083°C
	Thermal Conductivity	391 W/m·K
	Electrical Conductivity	>100% IACS
Chemical	Copper (Cu)	≥99.99%
	Oxygen (O₂)	≤0.0005%
Mechanical	Tensile Strength	220 MPa
	Yield Strength	70 MPa
	Elongation	≥30%
	Hardness (Vickers HV)	~50 HV

Suitable 3D Printing Processes for Copper C101

Process	Typical Density Achieved	Surface Roughness (Ra)	Dimensional Accuracy	Application Highlights
Direct Metal Laser Sintering (DMLS)	≥99%	10-14 µm	±0.1 mm	Enables fine-featured thermal and RF components with high electrical conductivity
Electron Beam Melting (EBM)	≥99.5%	20-30 µm	±0.15 mm	Suitable for high-mass thermal management parts with excellent material purity

Selection Criteria for Copper C101 3D Printing Processes

Conductivity Requirements: DMLS ensures over 95% IACS in printed form, ideal for waveguides, antenna components, and high-frequency connectors.
Part Size and Geometry: EBM is suitable for thicker geometries and high-volume thermal blocks; DMLS handles finer details for intricate electrical circuits.
Surface Finish Tolerance: Post-machining and polishing may be required to reduce Ra < 1 µm for high-performance electrical contact surfaces.
Post-Processing Necessity: Heat treatments may be applied to improve grain structure and conductivity post-printing without compromising precision.

Essential Post-Processing Methods for Copper C101 3D Printed Parts

CNC Machining: Used to refine surfaces and tolerances to ±0.02 mm for thermal interfaces and precise mounting geometries.
Electropolishing: Improves electrical contact and reduces surface roughness to <0.5 µm Ra for RF and electronic parts.
Heat Treatment: Conducted at ~400°C for 2 hours in a controlled atmosphere, enhancing conductivity and relieving internal stresses.
Tumbling: A mechanical finish to deburr and smooth external surfaces, ensuring optimal fit and surface functionality.

Challenges and Solutions in Copper C101 3D Printing

High Reflectivity: Laser absorption is low; optimized green laser technology or electron beams improve melting stability and density.
Thermal Conductivity: High conductivity leads to rapid heat dissipation; adjusted scan strategies maintain uniform melt pools.
Oxidation Sensitivity: Printing in inert argon or vacuum chambers prevents oxidation, preserving electrical and mechanical performance.

Applications and Industry Case Studies

Copper C101 is widely used in:

Electronics: RF shields, busbars, waveguides, connector housings.
Thermal Management: Cold plates, heat exchangers, cooling fins for high-power electronics.
Aerospace: Antenna components, power distribution systems, EMI shielding.
Medical: Custom electrical contacts and biocompatible thermal devices.

Case Study: RF waveguide prototypes 3D printed using DMLS and post-polished achieved >98% IACS conductivity and dimensional stability for aerospace communications systems.