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Silicon Dioxide (SiO2)

High-purity ceramic for 3D printed thermal, dielectric, and casting applications requiring excellent detail and thermal shock resistance.

Silicon Dioxide (SiO₂), commonly known as fused silica, is a lightweight, thermally stable ceramic with excellent dielectric and thermal shock resistance. It is widely used in investment casting, microfluidic devices, and high-temperature insulation applications.

With ceramic 3D printing, complex SiO₂ parts can be fabricated with high precision and minimal post-processing. Additive manufacturing allows for internal channels, fine detail, and seamless integration of complex features into lightweight, heat-resistant structures.

Silicon Dioxide Similar Grades Table

Grade Type	Purity (%)	Typical Applications
Fused Silica	≥99.8	Investment casting molds, aerospace insulation
Quartz (Crystalline)	99.5–99.9	Optical components, high-frequency electronics
Glassy SiO₂ (Amorphous)	96–99	Microfluidics, RF substrates, lab-on-chip devices

Silicon Dioxide Comprehensive Properties Table

Category	Property	Value
Physical Properties	Density	2.20 g/cm³
	Melting Point	~1715°C
	Thermal Conductivity (25°C)	1.4 W/(m·K)
	Electrical Resistivity (25°C)	>10¹⁶ Ω·cm
	Thermal Expansion (25–1000°C)	0.55 µm/(m·K)
Mechanical Properties	Hardness (Vickers)	500–600 HV
	Flexural Strength	60–100 MPa
	Compressive Strength	≥400 MPa
	Elastic Modulus	70 GPa
	Fracture Toughness (K₁C)	0.7–1.0 MPa·m½

3D Printing Technology of Silicon Dioxide

SiO₂ is primarily printed using Binder Jetting and Vat Photopolymerization (VPP), followed by debinding and sintering. These processes enable production of thin-walled, heat-tolerant, and highly intricate ceramic components.

Applicable Process Table

Technology	Precision	Surface Quality	Mechanical Properties	Application Suitability
Vat Photopolymerization (VPP)	±0.05–0.2 mm	Excellent	Good	Microfluidics, Optical Fixtures
Binder Jetting	±0.1–0.3 mm	Good	Moderate	Investment Casting Molds, Shells

Silicon Dioxide 3D Printing Process Selection Principles

VPP is recommended for fine-feature applications such as microchannels and thin-walled optical or sensor components, achieving surface finishes < Ra 2 µm and high shape fidelity.

Binder Jetting is ideal for large, complex casting molds and thermal shields with moderate resolution (±0.1–0.3 mm) and excellent thermal stability after sintering.

Silicon Dioxide 3D Printing Key Challenges and Solutions

High shrinkage (~20–25%) during sintering demands accurate scaling in CAD models and the use of reliable sintering profiles. Dimensional stability is achieved by optimizing thermal gradients and support strategies.

Porosity and cracking risk are managed by controlling debinding rates and using fine powders with high packing density. Final densities of 95–98% are typical.

Low fracture toughness requires careful handling and post-processing polishing to reduce surface stress concentrators, especially for microfluidic and optical applications.

Hygroscopic behavior of silica requires storage and printing in humidity-controlled environments (RH < 40%) to prevent defect formation.

Industry Application Scenarios and Cases

Silicon dioxide 3D printing is used in:

Aerospace: Lightweight thermal insulation, RF-transparent structures, and shell cores.
Electronics: Low-loss dielectric substrates and waveguide components.
Casting: Precision investment casting molds for turbine blades and engine housings.
Medical & Lab-on-Chip: Microfluidic cartridges, sensor arrays, and inert housing components.

In a recent aerospace casting application, binder jet 3D printed fused silica molds replaced multi-part ceramic shell assemblies, reducing tooling lead time by 60% and eliminating 4 assembly steps.